Antec Formula 7 Thermal Paste

Antec Formula 7 Thermal Paste compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec Formula 7 Thermal Paste for a diamond-caliber solution.

Antec Formula 7 Thermal Paste Specification

• Diamond particles measuring 0.0000015 cm rated at 8.3 w/mK
• Extended -50°C to 250°C stable temperature range ideal for performance cooling
• Lighter, easier to spread stable composition wonot crack or dry out
• Quantity: 4 g
• Specific gravity: 2.8 g/cm3

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